Smart Spatial Light Modulator Research and Development

Abstract

The objective of our research is to demonstrate 'smart' spatial light modulators (S-SLM) where electronic logic circuits are combined with light modulators and detectors. Our previous studies, while providing valuable insights, indicated that shortcomings of certain approaches limit their applicability to combine Si-based driver and logic circuits with PLZT modulators. For example, PLZT substrate damage limited laser recrystallization approach. Lastly, voltage compatibility problem exists that imposes difficulties in the integration of the modulator driver circuit (requiring 30-50V) in the Si- waver containing logic circuits (operating at 5V). In order to resolve these limitations we explored (1) two methods of implementing thin films of Si-band driver circuits directly onto PLZT substrates and (2) flip-chip bonding of Si wafer containing detector and logic circuits onto the silicon bonded directly to bulk PLZT substrate for fabrication of S-SLM.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Feb 28, 1993
Accession Number
ADA264928

Entities

People

  • Sing H. Lee

Organizations

  • University of California, San Diego

Tags

DTIC Thesaurus Topics

  • Detectors
  • Electroless Plating
  • Fabrication
  • Films
  • Flip Chips
  • Logic Gates
  • Low Temperature
  • Manufacturing
  • Materials
  • Modulators
  • Optical Modulators
  • Physical Properties
  • Reflectance
  • Reflection
  • Refractive Index
  • Thin Films
  • Transistors

Readers

  • Integrated Circuit Design and Technology.
  • Materials Science and Engineering.

Technology Areas

  • Directed Energy
  • Microelectronics
  • Microelectronics - Graphene