Si/SiO2 Interfere Studies by Immersion Ellipsometry

Abstract

The mechanisms associated with Si/SiO2 interface annealing and Thermal oxidation conditions were studied by spectroscopic immersion ellipsometry. Essentially, this surface sensitive ellipsometry technique uses liquids that refractive index match with the films, thereby optically removing the films. With the use of an optical model, it is shown that at annealing temperatures viscous relaxation dominates, while at low annealing temperatures the suboxide reduction is apparent. It is also shown that with the thickening SiO2 Overlayer, the thickness of the suboxide layer at the interface increases and the average radius of the crystalline silicon protrusions decreases for the three different orientation studied. These results are consistent with the commonly accepted Si oxidation model.... Spectroscopic immersion ellipsometry.

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Document Details

Document Type
Technical Report
Publication Date
May 04, 1993
Accession Number
ADA265151

Entities

People

  • Eugene A. Irene
  • Qingcao Liu

Organizations

  • University of North Carolina at Chapel Hill

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air
  • Annealing
  • Chemistry
  • Coefficients
  • Electron Microscopy
  • Geometry
  • Military Research
  • North Carolina
  • Optical Properties
  • Orientation (Direction)
  • Oxidation
  • Refractive Index
  • Semiconductor Devices
  • Semiconductors
  • Sensitivity
  • Thickness
  • United States

Fields of Study

  • Physics

Readers

  • Combustion and Flow Dynamics.
  • Semiconductor Device Technology
  • Spectroscopy.