Solderability of Surface Mount Devices
Abstract
As electronic products become much smaller, a limiting factor in the reduction of product size has been the size of electronic components which make up the product. The leads of the current electronic components are inserted onto a printed circuit board through holes. Due to the use of wire leads, it becomes more difficult to decrease the size of the components. A new method was created to mount components directly to the surface of the printed circuit board. This new technique is surface mount technology. A concern over the use of this is experienced by the military. Since the leads are not inserted through the board and crimped before soldering as conventional components are mounted, there is some regard as to whether the components can be mounted securely to the board. Due to the high forces that many munitions experience when dispensed, it is imperative that the electronic components be soldered to the circuits boards so they will not slip out of place or fall from the board. The military also requires many munitions to lie dormant in storage warehouses for up to 20 years. When the munition is needed, it must perform reliably. Little work has been done to study the effects of this long-term storage on these surface mount devices particularly the ability of different soldering techniques used to attach surface mount components to printed circuit boards to withstand damaging effects of long-term storage.... Surface mount technology, Solderability, Wave soldering, Reflow soldering, Conductive adhesive curing, Long-term storage, Accelerated age testing.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 01, 1993
- Accession Number
- ADA265751
Entities
People
- Nanette S. Holder
Organizations
- United States Army Armament Research, Development and Engineering Center