A Novel Photosensitive Polyimide Resist Consisting of a Soluble Polyimide and a Bis(perfluorophenyl Azide) as a Cross-Linker

Abstract

A photosensitive polyimide resist that consists of a soluble polyimide 5 and bisPFPA 6 as a cross-linker has been formulated. Polyimide 5 containing 11 wt% of bisPFPA has a deep-UV sensitivity of 30-35 mJ sq cm while polyimide 5 itself has a deep-UV sensitivity of 350-400 mJ sq cm. Under our present conditions, features of about 0.5 um could be resolved with this resist system.... Polymers, Deep-UV negative resist

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Document Details

Document Type
Technical Report
Publication Date
Jun 10, 1993
Accession Number
ADA265998

Entities

People

  • John F. Keana
  • M. N. Wybourne
  • Sui X. Cai

Organizations

  • University of Oregon

Tags

Communities of Interest

  • Biomedical

DTIC Thesaurus Topics

  • Alcohols
  • Anhydrides
  • Chemical Reactions
  • Chemical Synthesis
  • Chemistry
  • Civil Engineering
  • Electron Beam Lithography
  • Films
  • Materials
  • Military Research
  • Organic Chemistry
  • Photolysis
  • Physics
  • Polymers
  • Sensitivity
  • Surface Warfare
  • Universities

Fields of Study

  • Materials science

Readers

  • Nanofabrication and Microfabrication.