Dynamic High-Pressure Shock Compaction of Diamond Powders

Abstract

The present report summarizes investigations carried out on shock consolidation of diamond powders for fabrication of compacts for electronic substrate applications. Consolidation of various types of commercially available natural and synthetic diamond powders has been performed in this study. The type of diamond and morphology of the powder particles affects the consolidation mechanisms as well as the diamond compact characteristics. It is shown that with the use of appropriate particle size distribution, and therefore a high initial packing density, compacts with optimum physical characteristics crack-free and better than 90% of theoretical maximum density can be obtained. However, about 3-5% transformed graphite and extensive residual strain in the compacts has been detected, both of which severely limit the thermal conductivity. The work contained in this report provides an extensive series of experimental results and mechanistic studies discussing the consolidation behavior of diamond powders by the shock compression technique.

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Document Details

Document Type
Technical Report
Publication Date
May 25, 1993
Accession Number
ADA266004

Entities

People

  • A. Grebe
  • Daniel Goodwin
  • H. S. Shin
  • N. N. Thadhani
  • N. W. Page
  • P. A. Persson
  • R. Baugman
  • T. J. Arhens
  • V. S. Joshi
  • Z. Iqbal

Organizations

  • New Mexico Institute of Mining and Technology

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Weapons Technologies

DTIC Thesaurus Topics

  • Chemical Vapor Deposition
  • Controlled Atmospheres
  • Crystal Structure
  • Explosives
  • Heat Transfer
  • High Pressure
  • Material Degradation Processes
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • New Mexico
  • Packing Density
  • Particle Size
  • Particles
  • Plastic Explosives
  • Thermal Conductivity

Fields of Study

  • Materials science

Readers

  • Economics
  • Mechanical Engineering/Mechanics of Materials.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics