Liquid Cooled Heat Sink with Through Vias (LCHS)

Abstract

This document presents the results of the Liquid Cooled Heat Sink wit Through Vias (LCHS) Program. The goal of the program was to fabricate a structure with microchannels and through vias. The microchannels allow a heat dissipating liquid to flow through the structure while the vias provide an electrical pathway from the top of the structure to the bottom. A series of electrical and thermal tests were performed. The results of these tests have been interpreted. Recommendations to improve the current design was addressed.

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Document Details

Document Type
Technical Report
Publication Date
May 31, 1993
Accession Number
ADA266008

Entities

People

  • Charles W. Eichelberger
  • J. P. Kusior

Tags

DTIC Thesaurus Topics

  • Adhesives
  • Aspect Ratio
  • Assembly
  • Carbon Dioxide Lasers
  • Computer-Aided Design
  • Contracts
  • Fabrication
  • Flow
  • Flow Rate
  • Heat Sinks
  • Heating Elements
  • Integrated Systems
  • Lasers
  • Manufacturing
  • Polymers
  • Substrates
  • Thickness

Fields of Study

  • Engineering

Readers

  • Neurological Diseases/Conditions/Disorders
  • Robotics and Automation.
  • Thermal Physics or Thermal Science.