Polymers for Microelectronics

Abstract

A comparative study of polystyrene (PS) with bis(perfluorophenyl) azides 1-2 and the corresponding non-fluorinated bisazides 3-4 as deep-UV resists is reported. Inclusion of as low as 1.2 wt-% of 1 in PS led to 70% retention of film thickness after photolysis and development. PS containing 2.4 wt-% of 1 is > 100 times more sensitive as a deep-UV negative resist than PS itself. The presence of 1 in PS also increased the contrast of the resist. On a molar basis, 1 was about 10 times as effective as non-fluorinated bisazide 3 in cross-linking PS while 2 was about 6 times as effective as 4. PS containing 2.4 wt-% of 1 was found to have a deep-UV sensitivity of 5-10 mJ/sq cm and resolution of about 0.5 micrometer. Polymers, Deep-UV negative resists, Cross-linking.

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Document Details

Document Type
Technical Report
Publication Date
Jun 10, 1993
Accession Number
ADA266036

Entities

People

  • J. F. Keana
  • M. N. Wybourne
  • S. X. Cai

Organizations

  • University of Oregon

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Absorption
  • Absorption Spectra
  • Alkenes
  • Chemical Compounds
  • Chemical Synthesis
  • Chemistry
  • Contrast
  • Deep Ultraviolet Lithography
  • Electron Beam Lithography
  • Electron Beams
  • Lithography
  • Microelectronics
  • Military Research
  • Organic Chemistry
  • Photolithography
  • Photolysis
  • Polymers

Readers

  • Molecular and Cellular Biochemistry
  • Nanofabrication and Microfabrication.

Technology Areas

  • Microelectronics