RF Vacuum Microelectronics

Abstract

All layers of mask set 2 were received prior to Feb. 1. A photograph of the overall reticle layout is shown in figure 1. There are 16 reticles per 1 in. wafer and 9 different chips per reticle for a total of 149 chips of which about 120 are expected to be usable (about 30 chips are too close to the wafer edge). On this mask set we concentrated on straightforward arrays of tips of different sizes oriented in such a way that they could be conveniently package onto TO-8 headers. In the previous experiments we found the most significant impediment to consistency in testing was the bonding, die-attach and packaging.

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Document Details

Document Type
Technical Report
Publication Date
Mar 31, 1993
Accession Number
ADA266066

Entities

Organizations

  • Hughes Aircraft Company

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Barium
  • Barium Oxides
  • Ceramic Materials
  • Contracts
  • Emission
  • Emitters
  • Failure Mode And Effect Analysis
  • Geometry
  • Hydrogen
  • Materials
  • Metals
  • Microelectronics
  • Oxygen
  • Procurement
  • Resistance
  • Silicon Dioxide
  • Work Functions

Readers

  • Electronics Engineering
  • Instructional Design and Training Evaluation.
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems