Anisotropic Damage Mechanics Modeling in Metal Matrix Composites

Abstract

A consistent and systematic theory is developed for the analysis of damage mechanisms in metal matrix composites (MMCs). The theory involves both analytical and experimental procedures for the quantification of certain types of damage in MMCs. The analytical model involves both overall and local approaches to characterize damage in these materials. A series of experiments are conducted for micro- and macro-structural characterization of the MMC. Experiments were conducted on a titanium aluminide SiC-reinforced metal matrix composite. Center-cracked plates with laminate layups of (0/90)s, and (+/-45)s were tested under uniaxial tension. In order to investigate and model damage evolution, each of the specimens is loaded to different load levels ranging from fracture load down to 70% of the fracture load. Scanning electron microscopy (SEM) is performed on representative cross-sections of the damaged specimens. The measured crack densities are then used to define the damage parameters that are used in the theoretical model.... Metal matrix composites, Scanning electron microscopy, Damage parameters, Plasticity, Finite elements.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
May 15, 1993
Accession Number
ADA266328

Entities

People

  • Anthony R. Venson
  • George Z. Voyiadjis
  • Peter I. Kattan
  • Taehyo Park

Organizations

  • Louisiana State University

Tags

Communities of Interest

  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Air Force
  • Composite Materials
  • Constitutive Equations
  • Differential Equations
  • Elastic Properties
  • Engineering
  • Finite Element Analysis
  • Laminates
  • Measurement
  • Mechanics
  • Metal Matrix Composites
  • Microscopes
  • Silicon Carbide
  • Stress Strain Relations
  • Three Dimensional
  • Titanium Aluminide
  • Two Dimensional

Fields of Study

  • Materials science

Readers

  • Materials Science (Mechanical Engineering).
  • Reinforced Composite Materials

Technology Areas

  • Microelectronics