Multichip Module High Speed Testing

Abstract

Progress in the testing of multichip module electronic circuit packages for the period April 1, 1993 - June 30, 1993 is described below, in the areas of the testing of multichip modules using electrooptic polymers, the testing of high-speed transmission line structures, and the microfabrication of fiber optic test probes.

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Document Details

Document Type
Technical Report
Publication Date
Jun 30, 1993
Accession Number
ADA266968

Entities

People

  • David H. Auston
  • Robert J. Davis

Organizations

  • Columbia University

Tags

Communities of Interest

  • Advanced Electronics
  • Human Systems

DTIC Thesaurus Topics

  • Alkenes
  • Chemical Vapor Deposition
  • Chemistry
  • Chlorides
  • Electrical Engineering
  • Electronic Circuits
  • Electronics
  • Fabrication
  • Fibers
  • High Temperature
  • Implantation
  • Ion Implantation
  • Materials
  • Multichip Modules
  • Optical Fibers
  • Transmission Lines
  • Vapor Deposition

Readers

  • Aerospace Test and Evaluation
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics