Thermal Stresses Of A Trimaterial Medium In A Nonuniform Temperature Field

Abstract

The objective of this investigation was to conduct a parametric study of the effect of a nonuniform temperature field on the system behavior of a trilayered medium. In particular, the resulting shear and normal stresses along the media interfaces are analyzed. A finite element model utilizing a recently developed element which provides for both axial and lateral displacement continuity is employed. First, the effect of the material properties, that is, Young's Modulus and coefficient of thermal expansion, is examined. Then, the effect of the geometric properties, that is, length and thickness dimensions of the midlayer, is analyzed. Finally, a study of the effect of a nonuniform temperature field on the trimaterial medium is conducted.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1993
Accession Number
ADA267243

Entities

People

  • Michael J. Neibert

Organizations

  • Naval Postgraduate School

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Bending Stress
  • Climate Change
  • Coefficients
  • Displacement
  • Finite Element Analysis
  • Geometry
  • Materials
  • Mechanics
  • Modulus Of Elasticity
  • Nonuniform
  • Shear Stresses
  • Stresses
  • Thermal Expansion
  • Thermal Stresses
  • Thickness
  • Three Dimensional
  • Two Dimensional

Readers

  • Fluid Dynamics.
  • Structural Dynamics.