Knowledge Sources for an Intelligent MCM Analyzer.
Abstract
This research project resulted in the development of: (1) an intelligent methodology for finite element modeling and analysis of multichip modules (MCMs) for the purpose of rapid mechanical reliability assessment; (2) specific software modules, termed MCMs; and (3) a prototype proof-of-concept computer-based system that integrated these knowledge sources. The approach featured an object-oriented representation of the MCMs and their components. The modeling and analysis methodology itself was represented by the blackboard problem-solving paradigm in which individual experts solve specific tasks involved in finite element modeling and analysis of MCMs and post their results on a common blackboard accessible by the other experts. Several software modules from Sandia National Laboratory were used as well as the contractor developing a three-dimensional thermal analysis finite element code, called FEECAP3D, which includes sophisticated techniques for estimating the finite element discretization error All of these software codes were integrated into a blackboard-based proof-of-concept computer system called the Intelligent MCM Analyzer (IMCMA). Finite element analysis, Thermal analysis, Electronic packaging.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 01, 1993
- Accession Number
- ADA269224
Entities
People
- Anagha Jog
- Ian R. Grosse
- Prasanna Katragadda
Organizations
- University of Massachusetts Amherst