Fabrication Process for Cantilever Beam Micromechanical Switches

Abstract

This report presents a detailed process description for fabrication of a micromechanical accelerometer sensor switch. The switch consists of a metallic cantilever beam structure that is defined with silicon micromachining processing technology. The beam is made up of a gold-nickel-gold trimetallic structure, which is anchored at one end to a silicon substrate; the process was designed to be compatible with current integrated circuit technology used in industry. Accelerometer, Cantilever beam, Switch.

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1993
Accession Number
ADA269716

Entities

People

  • Bernard J. Rod
  • Timothy J. Mermagen

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Accelerometers
  • Arming Devices
  • Cantilever Beams
  • Chemical Vapor Deposition
  • Chemistry
  • Circuits
  • Electronics
  • Electronics Industry
  • Fabrication
  • Integrated Circuits
  • Manufacturing
  • Materials
  • Metal Oxide Semiconductors
  • Military Research
  • Semiconductor Manufacturing
  • Semiconductors
  • Substrates

Fields of Study

  • Physics

Readers

  • Computer Science/Computer Engineering/Data Science/Digital Signal Processing.
  • Nanofabrication and Microfabrication.