RF Vacuum Microelectronics

Abstract

This document reports progress on the following: (1) Stress in evaporated and sputtered moly metalization reduced; (2) Two chips evaluated at moderate current levels (6 devices/chip) and coated with 200 angstroms of silicon and zirconium carbide respectively; (3) High frequency alumina redesigned; and (4) Masks for optical lithography for low resolution steps obtained for increased throughput.

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Document Details

Document Type
Technical Report
Publication Date
Sep 16, 1993
Accession Number
ADA270003

Entities

Organizations

  • RTX

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Base Pressure
  • Coatings
  • Contracts
  • Deposition (Materials Processing)
  • Frequency
  • Ion Beams
  • Lithography
  • Low Resolution
  • Materials
  • Measurement
  • Microelectronics
  • Photolithography
  • Power Levels
  • Stresses
  • Tensile Stress
  • Test Stands
  • Vacuum Electronics

Fields of Study

  • Physics

Readers

  • Integrated Circuit Design and Technology.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene
  • Microelectronics - Microelectromechanical Systems