Focused-Ion-Beam Material Removal Rates

Abstract

Focused-ion-beam milling is a tool used in failure analysis and production of integrated circuits. This technique uses a focused gallium beam to mill away materials on a surface. Each material mills at a different rate, which must be experimentally determined. The data presented here for several materials used in standard integrated circuit processes will allow the user to determine the dose level needed to mill a certain amount of a given material.

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Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1993
Accession Number
ADA270852

Entities

People

  • Bruce Geil

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Abstracts
  • Barium Titanates
  • Ceramic Materials
  • Circuits
  • Compound Semiconductors
  • Electronics
  • Failure Analysis
  • Gallium Arsenides
  • Integrated Circuits
  • Ion Beams
  • Ions
  • Materials
  • Military Research
  • Semiconductors
  • Silicon Carbide
  • Silicon Dioxide
  • Standards

Fields of Study

  • Physics

Readers

  • Manufacturing Engineering.
  • Software Engineering
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene