Materials Processing and Manufacturing Technologies for Diamond Substrate Multichip Modules (DSMCM)

Abstract

Portions of a detailed surface kinetics mechanism-developed in collaboration with Michael Coltrin of Sandia National Laboratories-to describe the growth of diamond on a (100)-(2x1) surface have been refined extensively during this period. Specifically, it was discovered that the molecular mechanics program employed to calculate the thermophysical properties of the diamond structures was not parameterized for use with radical species. After discussions with the program's author (N,L. Allinger, Univ. Georgia, Athens) and extensive testing with experimentally validated compounds, MM3(92) has been re-applied to the 53 unique structures present in the surface mechanism to computer the temperature-dependent quantities enthalpy entropy, and heat capacity for each structure. These thermodynamic properties have been fit to polynomials over the temperature range 298.15 less than or equal T less than or equal 2000 K. The full mechanism is currently being incorporated into the stagnation flow model used to examine diamond deposition.

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1993
Accession Number
ADA271011

Entities

People

  • David S. Dandy

Organizations

  • Colorado State University

Tags

DTIC Thesaurus Topics

  • Boundary Layer
  • Chemical Engineering
  • Chemistry
  • Engineering
  • Fluid Dynamics
  • Heat Capacity
  • Hypobaric Conditions
  • Kinetics
  • Mass Spectrometry
  • Materials
  • Materials Processing
  • Measurement
  • Multichip Modules
  • Surface Chemistry
  • Technical Information Centers
  • Thermodynamic Properties
  • Thermophysical Properties

Readers

  • Combustion science or combustion engineering.
  • Quantum Chemistry
  • Thin Film Deposition Science.