AT and T OETC Quarterly Technical Report for July-September 1993

Abstract

VCSEL fabrication: New mask use for reducing the metal traces and increasing chip speed is completed, and used on the first wafer. This wafer, which also has full water SiO2 window passivation, has low Ith (approx. 4mA), moderate resistance (V(at 11 mA) approx 3.8 V), and good power (Lmax =1.65 mW). Transmitter packaging: Designs of SEL array driver IC and monitoring op amp circuits were obtained from Martin Marietta during the 8/3 package review in Murray Hill. Preliminary layout from the Film Integrated Circuit (FIC) was initiated. Update information on laser driver op amp chips and full schematics of the Tx module were received on 8/30. Delayed confirmation of final circuit design from Martin Marietta causes the final layout for the transmitter multichip module to be sent to MM on 9/24/93 for final approval

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Document Details

Document Type
Technical Report
Publication Date
Oct 10, 1993
Accession Number
ADA271703

Entities

People

  • Yiu-man Wong

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Accuracy
  • Arrays
  • Assembly
  • Circuits
  • Connectors
  • Cost Reductions
  • Detectors
  • Fabrication
  • Integrated Circuits
  • Laser Arrays
  • Lasers
  • Metals
  • Multichip Modules
  • Project Management
  • Standards
  • Technical Information Centers
  • Transmitters

Readers

  • Analytical Mechanics
  • Integrated Circuit Design and Technology.
  • Naval Engineering and Maritime Security

Technology Areas

  • Directed Energy
  • Directed Energy - Pulsed-Laser Deposition