Field Emitter Array RF Amplifier Development Project, ARPA Contract #MDA 972-91-C-0028 Phase 1, Option 1
Abstract
Successful electrical testing was performed on 44,460 tip array. High-frequency testing is underway, both in-house and at Litton subprogram site. The first two runs of 2 microns column devices are finished. Arrays of 232,630 tips have been successfully fabricated and are being electrically tested. Two fabrication runs of 4 microns column devices have been started and are proceeding on a revised schedule after delays in the initial photolithography step. More rigorous uniformity requirements have resulted in modification of the initial photolithography steps. An in-situ cleaning system was installed and evaluated in the test chamber. Additional testing is needed to bring the cleaning process under control. Development of low work function and metal coatings has focused on the optimization of the deposition process for tantalum nitride, and the development of deposition processes for lanthanum hexaboride and zirconium carbide. The chemical composition, resistivity, and growth rate of the deposited films is being analyzed by several methods. A device serialization method was implemented to improve record keeping on field emitter device testing.
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 15, 1993
- Accession Number
- ADA272567
Entities
People
- Bertram Hui