Scanning Probe Lithography. 2. Selective Chemical Vapor Deposition of Copper into Scanning Tunneling Microscope-Defined Patterns

Abstract

A scanning tunneling microscope (STM) has been used to define features having critical dimensions ranging from 0.05 to 5.0 micrometer within a self-assembled monolayer resist of octadecylmercaptan, HS(CH2)17CH3, confined to a Au (111) surface. Low temperature chemical vapor deposition (CVD) methods were used to metalize the STM-patterned surface with Cu. At substrate temperatures near 120 deg C, the Cu CVD precursor, hexafluoroacetylacetonatocopper(I)-(1,5- cyclooctadiene), disproportionates to deposit Cu on the STM-etched portion of the substrate, but not on the unetched methyl-terminated monolayer resist surface. At substrate temperatures significantly above 120 deg C the degree of selectivity is reduced, probably as a result of thermal desorption of the organomercaptan monolayer.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Nov 23, 1993
Accession Number
ADA273304

Entities

People

  • Claudia B. Ross
  • Jonathan K. Schoer
  • Mark J. Hampden-smith
  • Richard M Crooks
  • Thomas S. Corbitt

Organizations

  • University of New Mexico

Tags

Communities of Interest

  • C4I
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Advanced Materials
  • Chemical Reactants
  • Chemical Vapor Deposition
  • Chemistry
  • Desorption
  • Electrons
  • Lithography
  • Low Temperature
  • Materials
  • Materials Processing
  • Materials Science
  • Monomolecular Films
  • New Mexico
  • Precursors
  • Scanning
  • Substrates
  • Vapor Deposition

Readers

  • Electrochemical Surface Science
  • Nanofabrication and Microfabrication.
  • Thin Film Deposition Science.