The Formation of Conducting Gold Films by Thermal Decomposition and Direct Patterning Using Electron Beam Lithography of the Gold Cluster Au55P(C6H5)312Cl6
Abstract
In this paper we present the fabrication and electrical conductivities of conducting gold cluster films. The films are deposited onto a Si3N4 substrate from a gold cluster solution by spin coating. After thermal decomposition and annealing at 180 deg C, a granular gold film with a resistivity of about 10(exp-6) ohms-m is formed. Resistivity measurements as a function of temperature show a low residual resistivity ratio. The low temperature resistivity indicates an electron mean-free-path close to the cluster diameter, and the temperature dependent resistivity is found to be in agreement with the Block-Gruneisen model. The spin coated gold cluster film also acts as a negative electron beam resist. Fine structures as small as 0. micrometer can be patterned directly by electron beam exposure. The electron beam exposed structures were found not to be conducting even after chemical extraction and firing.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 06, 1993
- Accession Number
- ADA273720
Entities
People
- Ceceli A. Duchi
- Jianzhi Wu
- M. Kanskar
- M. N. Wybourne
- Sui X. Cai