Critical Survey of Plasma Processing
Abstract
Low temperature plasmas represent an expansive region in the density- temperature parameter space of experimentally generated plasmas. With densities ranging from 10(exp 6) to 10(exp 17) cu cm, and temperatures ranging from 10(exp -2) to 10 eV, these plasmas exhibit a variety of collective behaviors, supporting many physical states and interactions among the particle species within the plasma. It is precisely this variety in physical conditions that lends the plasma environment so well to the myriad of applications that have developed in plasma processing. These applications are examples by; processing of solid state materials by ion implantation, thin film deposition, plasma enhanced chemical vapor deposition, plasma etching and also applications involving hardening and improving wear and corrosion resistance of refractory metals and composites. These applications have enjoyed great advancement in technological development. Much of this advancement is very system dependent and does not enjoy the fundamental scientific underpinning evident in other disciplines. The absence of this strong theoretical foundation is not only of interest for the aesthetics of academics inquiry of poorly understood systems, but also of interest due to the practical benefit of industrial technology expansion. Both, system process optimization and cross disciplinary transfer of technology would be aided by a strengthening in the understanding of the foundation that supports technological advances. This increased understanding can form the basis of expanding beyond existing system specific parameters and providing for process optimization and design.
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 28, 1993
- Accession Number
- ADA274233
Entities
People
- William P. Marable
Organizations
- Hampton University