Three Dimensional Transient Analysis of Microstrip Circuits in Multilayered Anisotropic Media
Abstract
In high-speed digital circuits, high frequency phenomena affects the characteristics of the interconnections. Physical discontinuities or nonuniformities in the connections may cause severe reflections when they can no longer by considered as conducting wires, but behave as transmission lines and/ or waveguides. In multilayered digital circuits, vias constitute one of the most commonly-used class of interconnects. Vias are not good carriers of high-speed signals. They cause signal distortion and reflections as well as severe degradation in the high frequency components. The analysis and modeling of a single via and some quasi-static or quasi-TEM analyses of single via configurations have been carried out previously. To data, the analysis of coupled noise between adjacent vias has received very little attention. The major reasons include the complexity of multi-via structures and the difficulty of modeling and analyzing them accurately over a broad frequency range.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 18, 1994
- Accession Number
- ADA274995
Entities
People
- Jinau Kong
Organizations
- Massachusetts Institute of Technology