The Influence of Temperature on Microelectronic Device Failure Mechanisms. Phase 2
Abstract
There has been a common belief that reliable electronics can be achieved by lowering temperature. Elevated temperature has in the past been considered a dominant stress that lowers reliability, so every effort has been made to lower operating temperature until the desired reliability is achieved. The belief in the harmful effects of temperature has woven itself into today's screening and thermal derating processes. High-reliability applications require that the microelectronic device be subjected to high-temperature stress screens, like burn-in, to improve the reliability of the product. Moreover, thermal derating measures for microelectronics often involve lowering temperature.
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 04, 1993
- Accession Number
- ADA275029
Entities
People
- Michael G. Pecht