A Novel Approach to the Fabrication of SiC Structures of Arbitrary Shape

Abstract

As a result of the Phase I research, we can reproduce clad silicon carbide films onto graphite rod substrates. During the course of our research we varied the melt composition, temperature and crucible material. The resultant silicon carbide films were confirmed, independently by Charles Evans Associates using electron microscopy and elemental x-ray analysis. The minimum temperature for silicon carbide formation was determined. The relationship between film thickness and maximum melt temperature was studied. The importance of complete oxygen exclusion was determined. The presence of the proprietary flux was found to be essential in this regard The thickness and integrity of these films are not yet suitable for commercial applications. It is anticipated, that the use of higher temperatures will yield silicon carbide films suitable for extreme environment applications. A new high-efficiency high-temperature furnace was designed with a maximum working temperature of 2000 deg C.

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Document Details

Document Type
Technical Report
Publication Date
Dec 31, 1993
Accession Number
ADA275475

Entities

People

  • Martin F. Wolf

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Ceramic Materials
  • Compound Semiconductors
  • Construction
  • Elements
  • Energy Bands
  • Extreme Environments
  • Fabrication
  • Graphitic Materials
  • High Temperature
  • Manufacturing
  • Materials
  • Physical Properties
  • Silica Glass
  • Silicon
  • Silicon Carbide
  • Silicon Compounds
  • X Rays

Fields of Study

  • Materials science

Readers

  • Semiconductor Device Technology
  • Surface Engineering/Surface Coating Technology.
  • Theoretical Analysis.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene