An Extended Approach to Oxidations and Nitridations of Si and Ge(x)Si(1-x) Materials

Abstract

The effect of germanium on the hot electron current of metal-oxide- semiconductor devices has been studied by avalanche electron injection from the silicon to silicon dioxide. Different doses of germanium ranging from 10(exp12) to 10(exp15) atoms/sq cm are implanted into Si-SiO2 interface. The lucky hot electron population is suppressed by germanium implantation. We have used the charge-voltage technique to measure the interface state density. The interface state density increase caused by Ge implantation is negligible if the dose is lower than 10(exp14) Ge/sq cm. We have also used different implantation energies to locate the Ge peak at different locations in the Si. We found that when the peak is at Si-SiO2 interface, the hot electron population is the lowest. Our results show that Ge implantation is a promising method to solve the hot carrier problem that has become important in submicrometer devices.

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Document Details

Document Type
Technical Report
Publication Date
Feb 04, 1994
Accession Number
ADA276056

Entities

People

  • Donald R Young .
  • Ralph J. Jaccodine

Organizations

  • Lehigh University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Band Structures
  • Dioxides
  • Electrical Engineering
  • Energy Bands
  • Field Effect Transistors
  • Implantation
  • Materials
  • Metal Oxide Semiconductors
  • Metal Oxides
  • Military Research
  • Oxidation
  • Oxides
  • Semiconductor Devices
  • Semiconductors
  • Silicon Dioxide
  • Universities

Fields of Study

  • Materials science

Readers

  • Parasitology and Pharmacology of Malaria.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics