Optoelectronic Processing Component Development

Abstract

The goal of this program is to develop an Optoelectronic Integrated Circuit (OEIC), consisting of electronic logic and optical I/O, as a critical element for computing and processing systems in which two dimensional planes of processing elements are connected in the third dimension. Our approach to this OEIC consists of monolithically integrating vertical cavity surface emitting laser (VCSELs), GaAs ion implanted photodetectors, and GaAs Field Effect Transistor (FET) based electronic logic into a two-dimensional array of 'smart pixels'. We will be collaborating with one or two groups doing research in the area of computing or processing architectures in order to define the logic functions which would be incorporated into the chips. Chips fabricated under the program would then be provided to these architecture research groups for use in subsequent system experiments. The main challenge to be addressed under this program involves the development of the fabrication techniques required to monolithically integrate these dissimilar devices.

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Document Details

Document Type
Technical Report
Publication Date
Mar 24, 1994
Accession Number
ADA277673

Entities

People

  • Mary Hibbs-brenner

Organizations

  • Honeywell International, Inc.

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Circuits
  • Contracts
  • Crystals
  • Dioxides
  • Electrical Circuits
  • Elements
  • Fabrication
  • Field Effect Transistors
  • Integrated Circuits
  • Lasers
  • Materials
  • Metal-Semiconductor Junctions
  • Polycrystals
  • Schematic Diagrams
  • Silicon Dioxide
  • Surface Emitting Lasers
  • Two Dimensional

Readers

  • Parallel and Distributed Computing.
  • Quantum Dot Semiconductor Device Photonics and Graphene Optoelectronic Materials and THz Physics.
  • Semiconductor Device Technology

Technology Areas

  • Directed Energy
  • Microelectronics