SETA Support for the DARPA Microelectronics Technology Insertion Program of the Microelectronics Technology Office

Abstract

Booz-Allen & Hamilton provides DARPA's Microelectronics Technology Office with a broad range of SETA support under contract MDA972-92-C-0029. This report describe activities during the first quarter of this contract. The main programs supported were: the Digital Gallium Arsenide Insertion Program, the Transition of Optical Processors to Systems (TOPS), the Microelectronics Manufacturing Strategy (MMST) Program, the Flexible, Intelligent Microelectronics Manufacturing Program (FIMM),and the Artificial Neural Networks Technology Program (ANNT). In addition, support was begun to a new High Speed Circuit Design Program. This report is organized by subtask areas in the statement of work, indicating for each subtask the Task Objectives, General Methodology, Technical Results, and Important Findings and Conclusions. The final section of this report presents a summary and conclusions, and the appendices present trip reports, meeting schedules, and some viewgraphs generated during this quarter of the contract.

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Document Details

Document Type
Technical Report
Publication Date
Feb 15, 1992
Accession Number
ADA277686

Entities

People

  • Daniel H. Butler Jr.

Organizations

  • Booz Allen Hamilton

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Assembly
  • Compound Semiconductors
  • Computer Programs
  • Electronics Laboratories
  • Engineering
  • Etching
  • Fabrication
  • Gallium Arsenides
  • Heterojunction Bipolar Transistors
  • Integrated Circuits
  • Manufacturing
  • Materials
  • Modules (Electronics)
  • Semiconductor Devices
  • Semiconductor Manufacturing
  • Semiconductors
  • Very Large Scale Integration

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Technical Research and Report Writing.

Technology Areas

  • AI & ML
  • AI & ML - DoD AI Strategy
  • Microelectronics