Ceramic/Metal Composite Circuit-Board-Level Technology for Application Specific Electronic Modules (ASEMs)

Abstract

The quarterly progress for the Ceramic/Metal Composite Circuit-Board- Level Technology for Application Specific Electronic Modules is described in this report. Data is reported for the following tasks: Metal Core Fabrication, LTCC Ceramic Development, and Thin Film Interconnect Structure Integration

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Document Details

Document Type
Technical Report
Publication Date
Mar 23, 1994
Accession Number
ADA277961

Entities

People

  • A. H. Kumar
  • A. N. Prabhu
  • A. Sussman
  • B. J. Thaler

Organizations

  • Sarnoff Corporation

Tags

DTIC Thesaurus Topics

  • Ceramic Materials
  • Circuit Boards
  • Coatings
  • Composite Materials
  • Crystal Structure
  • Dielectric Properties
  • Dielectrics
  • Fabrication
  • Films
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Metal Matrix Composites
  • Thick Films
  • Thin Films
  • Two Dimensional

Readers

  • Small Business Innovation Research Program (SBIR) EDI Research and Innovation.
  • Software Engineering
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene