Liquid Metal Cluster Ion Source Technology for Repair of Packaging Interconnects

Abstract

We have proposed the development of a direct metal etch and write (DMEW) Technology based on recently developed liquid metal cluster ion sources (LMCIS) for repair of conducting paths in polymer and ceramic systems. This technology has been shown to be capable of depositing both gold and solder at deposition rates as high as 100,000 cubic microns per second at feature resolutions of 25-100 microns. The LMCIS's advantages over competing direct write technologies, such as laser direct write and e-beam direct write, include high deposition rate no pre- or post-processing, good adhesion and almost bulk metallization resistivity. This high throughput and localized deposition capability will enable this technology to be useful in optical test and repair of multi-layer high density interconnect substrates and populated MCMs, bare die bumping, and personalization of semi-custom MCMs. The objectives of this project during phase I are to demonstrate the feasibility of this patented and proprietary direct write technology for repair of conducting paths in polymer and ceramic systems. In phase II we will develop a production worthy DMEW tool and related process technologies.

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Document Details

Document Type
Technical Report
Publication Date
Nov 30, 1993
Accession Number
ADA278622

Entities

People

  • Howard Schmidt
  • Rao Goruganthu

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Adhesion
  • Aspect Ratio
  • Bonding
  • Feasibility Studies
  • Flip Chips
  • High Density
  • Integrated Circuits
  • Ion Sources
  • Ions
  • Liquid Metals
  • Liquids
  • Packaging
  • Production
  • Schematic Diagrams
  • Substrates
  • Vacuum Chambers

Readers

  • Integrated Circuit Design and Technology.
  • Thin Film Deposition Science.

Technology Areas

  • Directed Energy