An Adaptive, Unstructured, Finite-Element, Multi-Material, Thermal Analysis

Abstract

An efficient method has been developed for obtaining a high- resolution temperature distribution of the transient heat conduction inside an arbitrary domain containing any number of anisotropic materials. The method combines an adaptive, unstructured, mesh generation technique and a finite- element analysis program for a multi-material thermal analysis. The technique allows easy generation of fine elements in a high-temperature gradient area and coarse elements in a low-temperature gradient area to enhance the quality of analysis results with minimum effort and cost. Continuity of finite-element mesh across the boundaries of multiple materials is precisely preserved. The thermal conduction inside an infinite cylinder and inside a two-layer slab is analyzed, and the results are compared to the exact solution to validate the solution procedure. Application of the method to investigate heat penetration in the Titan 4 Solid Rocket Motor Upgrade nozzle flexseal of a multi-material structure is demonstrated. Extension of the method to calculate thermal response of a Star-37S nozzle/exit cone insulation and supporting structure with complicated, multiple charring materials is discussed.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1993
Accession Number
ADA278632

Entities

People

  • I-shih Chang

Organizations

  • The Aerospace Corporation

Tags

Communities of Interest

  • Weapons Technologies

DTIC Thesaurus Topics

  • Boundaries
  • Charring
  • Computational Fluid Dynamics
  • Conduction (Heat Transfer)
  • Finite Element Analysis
  • Heat Energy
  • Heat Transfer
  • High Resolution
  • High Temperature
  • Insulation
  • Materials
  • Rocket Engines
  • Rockets
  • Temperature Gradients
  • Thermal Analysis
  • Thermal Conductivity
  • Three Dimensional

Readers

  • Computational Fluid Dynamics (CFD)
  • Plasma Physics / Magnetohydrodynamics
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics