ARPA Market Study. Appendices

Abstract

Appendices: DICE Concurrent Engineering Environmental Overhead Presentation; STEP Tools, Inc. Presentation Materials; The Standard Data Access Interface; Implementing AP Inter-operability using STEP-VIEWS; STEP Software for World-wide Manufacturing; Detailed Description of CFI DR 1.0; DIE Information Exchange (DIE) Format Reference Manual (Chapter 1); ASEM CAx Interface Specification Alliance Program Plan and Roadmap; Market Study Telemarketing Survey; EDA DICE Market Study Telemarketing Program; Marketing Survey List; Basic Statistics; and EDA Commercial Vendor List.

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Document Details

Document Type
Technical Report
Publication Date
May 10, 1994
Accession Number
ADA279291

Entities

People

  • Kenneth Drake
  • Martin Hardwick
  • Randolph E. Harr
  • Siuki Chan

Tags

Communities of Interest

  • Advanced Electronics
  • Space

DTIC Thesaurus Topics

  • Advanced Manufacturing
  • Application Protocols
  • Artificial Intelligence
  • Assembly
  • Circuit Boards
  • Computers
  • Electronic Circuits
  • Electronics
  • Engineering
  • Fabrication
  • Manufacturing
  • Molecular Orbital Theory
  • Standards
  • Stereolithography
  • Thin Films
  • Three Dimensional
  • Trade Associations

Readers

  • Business Analytics
  • Software Engineering
  • Software Engineering.