Consortia for Known Good Die (KGD). Phase 1

Abstract

This report describes the results of Phase I of the Infrastructure for KGD program at MCC. The objective of the work is to resolve the issues for supplying and procuring Known Good Die (KGD) in a way that fosters industry acceptance and confidence in Application Specific Electronic Modules (ASEMs for military systems) and MultiChip Modules (MCMs for commercial systems). This report is divided into four sections. Section I describes the technical assessment of proposed industry approaches to KGD implementation. Section II of the report contains an outline for the plan for industry and government cooperation for the demonstration, validation, and implementation of KGD methodologies identified in this Phase I study. Section III of the report contains the industry-generated requirements for KGD implementation. Section IV of the report contains the KGD specifications for TAB and flip chip ICs. Known good die, Test, Burn-in, KGD Technology assessment guidelines.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1994
Accession Number
ADA279407

Entities

People

  • Chad Noddings
  • Charles Spooner
  • Cindy Murphy
  • Claude Rathmell
  • David Carey
  • Greg Pitts
  • Larry Gilg
  • Marshall Andrews
  • Mary M. Fellows

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Accuracy
  • Circuit Boards
  • Conductive Polymers
  • Dielectrics
  • Electronics Industry
  • Fabrication
  • Integrated Circuits
  • Management Personnel
  • Manufacturing
  • Materials Testing
  • Modules (Electronics)
  • Semiconductor Devices
  • Semiconductor Manufacturing
  • Semiconductors
  • Test And Evaluation
  • Test Equipment
  • Test Methods

Readers

  • Instructional Design and Training Evaluation.
  • Integrated Circuit Design and Technology.
  • Software Engineering

Technology Areas

  • Microelectronics