Materials Research for GHz Multi-Chip Modules

Abstract

The goal of this program is to investigate new dielectrics, metals and processes for the fabrication and characterization of multi-chip modules (MCM) which hold the promise of excellent performance, cost and yield for high frequency MCMs. First, the processes for using noble metals (gold and silver) as the interconnection metallization in the module have been investigated. Noble metal process can have fewer processing steps (particularly for gold) than the equivalent copper process and are potentially lower cost, particularly when high reliability is important. The silver process has been developed so that the silver maintains its bulk conductivity (highest of conventional metals) and has low residual stress during high temperature processing. The commercialization of the silver process is being considered. Second, a unique adhesion material has been investigated and is currently being investigated for commercial use. We are in the process of evaluating the process and with n-Chip and transferring the technology to them.

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Document Details

Document Type
Technical Report
Publication Date
Sep 30, 1993
Accession Number
ADA279661

Entities

People

  • Paul A Kohl

Organizations

  • Georgia Tech

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Chemical Vapor Deposition
  • Conductivity
  • Contracts
  • Dielectric Permittivity
  • Dielectric Properties
  • Dielectrics
  • Electrical Properties
  • Fabrication
  • Failure Mode And Effect Analysis
  • Films
  • High Reliability
  • High Temperature
  • Low Temperature
  • Materials
  • Mechanical Properties
  • Metals
  • Test And Evaluation

Readers

  • Integrated Circuit Design and Technology.
  • Surface Engineering/Surface Coating Technology.