Dielectric Models in Adhesion and Extrapolations of Molecular Modeling
Abstract
In order to separate mechanical mechanisms of adhesion such as surface roughness, chain entanglement, or even chemical reaction from mechanisms based upon the dielectric nature of interface interaction, highlights of dielectric theory dealing with cohesion and adhesion are reviewed. Elements of those theories are applied in order to gain insight into experimental results of adhesive systems taken from the literature. From this analysis dielectric-based explanations are offered for general adhesion trends, including explanations of metal to nonmetal adhesion trends based upon properties of the changing metal and the constituents of the interface. An example of how a dielectric-based explanation could be used to rationalize contributions from both the interface compositions and bulk components is also given. Finally an example of dynamic molecular modeling is given in order to compare current computer models of adhesion.
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 01, 1994
- Accession Number
- ADA279675
Entities
People
- Nancy E. Iwamoto
Organizations
- Naval Air Warfare Center Weapons Division