Interaction Effects of Cracks, Flaws and Damage in Ceramic

Abstract

It is generally recognized that the nature of grain boundaries and microstructures affects the properties and behavior of ceramics. One of the objectives of this research is to study the fracture process of the ceramic in real time and to measure the strain field in the vicinity of the crack including the bridging zones. A fast-scanning electron microscope (FSEM) for dynamic microscopy applications was used to capture the fracture events in the ceramic. This equipment captures images at high speed. The SEM chamber was also modified to accommodate an in-situ tension-compression loading device to fracture ceramics. The fracture mode was predominantly intergranular. No indication of a microcrack-cloud zone was observed in the FSEM results. Grain bridging was observed along the entire crack interface and over the entire propagation distance. Grain boundaries, Microstructures.

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Document Details

Document Type
Technical Report
Publication Date
May 04, 1994
Accession Number
ADA280368

Entities

People

  • Howard L. Schreyer
  • Ming L. Wang

Organizations

  • University of New Mexico

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • C4I

DTIC Thesaurus Topics

  • Brushless Dc Motors
  • Ceramic Materials
  • Ceramic Matrix Composites
  • Computational Science
  • Computer Programs
  • Control Systems
  • Finite Element Analysis
  • Materials
  • Materials Science
  • Measurement
  • Mechanical Properties
  • Mechanical Working
  • Mechanics
  • Modulus Of Elasticity
  • Phase Transformations
  • Three Dimensional
  • Two Dimensional

Fields of Study

  • Materials science

Readers

  • Computational Modeling and Simulation
  • Materials Science (Mechanical Engineering).
  • Radar Systems Engineering.

Technology Areas

  • Microelectronics