Defect Initiation/Growth and Energy Dissipation Induced by Deformation and Fracture.

Abstract

Based on our capabilities to (a) detect and characterize particle release from surfaces on fast time scales, (b) to measure rapid electrical transients, and (c) to obtain high resolution topographical information utilizing scanning tunneling and atomic force microscopy, we have investigated a number of defect initiation and growth processes which ultimately leads to fracture and energy dissipation. We employ dynamic methods as well as post- fracture examination in polymers, ceramics, metals, and interfaces. We have examined mechanisms, with interpretation and connections between these results and the creation and evolution of defects in materials under mechanical stress. The information we, are acquire with our techniques has important implications concerning dissipation of energy (e.g., plastic deformation, microcracking, crack branching, and crack deflection) which play critical roles in controlling the strength and toughness of materials. Deformation, Crack propagation, Fracture, Particle emission, Fractro-emission, Interfacial failure, Crazing, Electrical transients, Micro-Cracking, Contact charging, Fractography, Scanning tunneling, Microscopy, Atomic force microscopy, Photoluminescence, Chemisorptive electron emission.

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Document Details

Document Type
Technical Report
Publication Date
May 15, 1994
Accession Number
ADA280411

Entities

People

  • J. T. Dickinson

Organizations

  • Washington State University

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Chemistry
  • Cracks
  • Electron Emission
  • Fermi Levels
  • Geometry
  • Material Degradation Processes
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Measurement
  • Mechanics
  • Metal Matrix Composites
  • Optical Materials
  • Partial Pressure
  • Single Crystals
  • Thin Films

Readers

  • Materials Science (Mechanical Engineering).
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics