Ceramic/Metal Composite Circuit-Board-Level Technology for Application Specific Electronic Modules (ASEMs)

Abstract

The quarterly progress for the Ceramic/Metal Composite Circuit-Board- Level Technology for Application Specific Electronic Modules is described in this report. Data is reported for the following tasks: Metal Core Fabrication, LTCC Ceramic Development, and Thin Film Interconnect Structure Integration.

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Document Details

Document Type
Technical Report
Publication Date
Jun 21, 1994
Accession Number
ADA281069

Entities

People

  • Barry Thaler

Organizations

  • Sarnoff Corporation

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Circuit Boards
  • Composite Materials
  • Dielectric Permittivity
  • Dielectric Properties
  • Dielectrics
  • Electrical Properties
  • Fabrication
  • Films
  • Laser Drilling
  • Manufacturing
  • Materials
  • Materials Processing
  • Materials Science
  • Metal Matrix Composites
  • Thermal Expansion
  • Thick Films
  • Thin Films

Readers

  • Reinforced Composite Materials
  • Small Business Innovation Research Program (SBIR) EDI Research and Innovation.
  • Software Engineering

Technology Areas

  • Microelectronics