Mobility Measurement and Computer Simulation at Specific Sites in Polystyrene Solutions and Gels

Abstract

Trans-- > cis photoisomerization of azobenzene chromophore labeled at the chain center, the chain end, or as a side chain of polystyrene as well as free probe was studied to investigate the mobility at specific chain sites in polymer solutions and gels. The site dependency of the chain mobility indicated that the chain center was least affected by increasing concentration, followed by the chain end and the side chain. Computer simulation to predict segmental density near the chromophore supports the experimental trends. Also photoisomerization of 50% atactic polystyrene (aPS) solutions in toluene and tetrahydrofuran was studied as a function of temperature from 25 deg C to -60 deg C. In aPS / toluene gel, the chain mobilities of the chain center and the chain end showed significant changes near the T sub gel, while side chain and free probe exhibited little change. Effects of concentration and temperature were characterized by bulk viscosity measurement to see how chain mobility is influenced at specific sites. Trans-->cis photoisomerization, Azobenzene labels, Chain center, Chain end, Side chain, Polystyrene solution and gel, Computer simulation, Segment density

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1994
Accession Number
ADA281214

Entities

People

  • A. Glynn
  • Chong S. Sung
  • Y. S. Kim
  • Yong Hwan Kim

Organizations

  • University of Connecticut

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Azobenzenes
  • Chemical Compounds
  • Chemistry
  • Computer Simulations
  • Computers
  • Dielectric Polymers
  • Energy Transfer
  • Films
  • Gelation
  • Materials
  • Materials Science
  • Polymeric Films
  • Polymers
  • Polystyrenes
  • Simulations
  • United States
  • Universities

Fields of Study

  • Chemistry

Readers

  • Mathematics or Statistics
  • Optical Physics and Photonics.
  • Polymer Science and Engineering.