Liquid Cooled Heat Sink with Through Vias (LCHS)

Abstract

A Liquid Cooled Heat Sink with Through Electrical Vias was designed fabricated and tested. The Heat Sink was designed for use in 3D stacks of high heat producing multichip modules. The report covers design considerations, the fabrication process and measured performance achieved A special section compares the Heat Sink performance to an equivalent diamond heat sink. A second special section discusses the economics of high volume production of the Heat Sink. Important performance results include: (1) Power Density of 5OW/cm2 with temperature rise of 15C. (2) 100 thru vias per sq cm (3) Thickness of 1.25mm.

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Document Details

Document Type
Technical Report
Publication Date
Sep 30, 1993
Accession Number
ADA281450

Entities

People

  • Charles W. Eichelberger
  • J. P. Kusior

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Aluminum Nitrides
  • Circuit Boards
  • Circuits
  • Equations
  • Fabrication
  • Flow
  • Flow Rate
  • Heat Sinks
  • Heat Transfer
  • Heating Elements
  • Lasers
  • Materials
  • Multichip Modules
  • Printed Circuits
  • Thermal Conductivity
  • Three Dimensional
  • Water Flow

Readers

  • Integrated Circuit Design and Technology.
  • Thermal Physics or Thermal Science.