Japanese Advanced Semiconductor Manufacturing

Abstract

During the week of April 5 through 9, 1993 an ARPA technology assessment team visited four Japanese semiconductor companies and one Japanese university to evaluate Japanese trends in flexible manufacturing and assess their strategic direction. Of the manufacturing facilities visited, the Mitsubishi 16Mb DRAM facility in Saijo was the most advanced and provided good insight into the Japanese manufacturing directions. All of the manufacturing sites (excluding Tohoku University) are on the classic mega-fab trend which will result in the multi-billion dollar next-generation facilities. Although several of the companies visited knew of the MMST program, we saw no evidence of an analogous Japanese program. Contrary to US manufacturers, the Japanese manufacturers have little concern over the capability and cost of lithography tools and processes.

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Document Details

Document Type
Technical Report
Publication Date
Jun 21, 1992
Accession Number
ADA281571

Entities

People

  • Nicholas J. Naclerio
  • Yoon Soo Park
  • Zachary J. Lemnios

Organizations

  • Defense Advanced Research Projects Agency

Tags

DTIC Thesaurus Topics

  • Application-Specific Integrated Circuits
  • Charge Coupled Devices
  • Chemical Vapor Deposition
  • Complementary Metal-Oxide Semiconductors
  • Electronics Industry
  • Electronics Laboratories
  • Fabrication
  • Integrated Circuits
  • Large Scale Integration
  • Manufacturing
  • Mass Production
  • Materials
  • Metal Oxide Semiconductors
  • Modules (Electronics)
  • Power Electronics
  • Semiconductor Devices
  • Semiconductors

Readers

  • Asian Economic Studies
  • Economics
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics