Natural Convection Cooling of a Three by Three Array of Leadless Chip Carrier Packages in a Dielectric Liquid
Abstract
Liquid cooling of a three-by-three array of commercially available leadless chip carrier packages, mounted on a ceramic substrate was examined. Baseline data were obtained for cooling with pure dielectric liquids. The effects of addition of high thermal conductivity ceramic powder to the liquid were next examined, both for natural and forced circulation conditions. Vertical and horizontal orientations were studied, for two different ceramic particle types, and two different particle sizes for each ceramic. For a range of chip power levels, chip, substrate and cold plate temperatures were measured. Interpretations for these data are provided. A numerical model was developed for the vertical geometry and compared to the measurements obtained. Immersion cooling, Ceramic, Electronics, Cooling, Enhancement, Natural convection, Forced convection.
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 24, 1994
- Accession Number
- ADA282298
Entities
People
- Joseph M. Bradley
Organizations
- Naval Postgraduate School