Demonstration of a Field Rehabilitation Technique for Removing Corrosive Solder Flux in Cold Water Copper Piping Systems

Abstract

Premature Failures in copper potable water systems are often a direct result of poor installation practices. One practice that can lead to accelerated corrosion and failure of copper piping systems, particularly those used to convey cold water, is the use of excessive soldering flux. This report evaluates a technique for mitigating corrosion induced by solder flux. The technique involves flushing the affected system with hot water (150 to 170 degrees F) at a high velocity to remove soldering flux residue that may still be inside the copper tubes and fittings. The technique has been tested at Fort Stewart, GA under the FEAP demonstration program and has been quite successful in mitigating the problem. The technique is ideal to field use since it is relatively simple and does not require removing any piping or destroying walls or floors. It is an environmentally acceptable technique, as it does not require the use of chemicals

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1994
Accession Number
ADA282794

Entities

People

  • J. R. Myers
  • O. S. Marshall
  • R. H. Knoll
  • V. F. Hock
  • V. L. Van Blaricum

Organizations

  • Construction Engineering Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Chemical Analysis
  • Chemical Synthesis
  • Chemistry
  • Cold Water
  • Corrosion
  • Drinking Water
  • Engineering
  • Field Tests
  • Hot Water
  • Laboratory Tests
  • Piping Systems
  • Soldering
  • Soldering Fluxes
  • Water
  • Water Chemistry
  • Water Flow
  • Water Supplies

Readers

  • Environmental Engineering
  • Facility/Structural Engineering.
  • Surface Engineering/Surface Coating Technology.