Investigation of Dipolar Reorientation Dynamics of Pure Bulk Polymers Using Second Harmonic Generation

Abstract

Second harmonic generation (SHG) in three corona-poled, pure, bulk polymers is studied as a function of temperature. It is found that this technique readily yields dynamical information that is complementary to that obtained from the technique of dielectric relaxation (DR). The SHG results are compared to those from DR in the same temperature ranges above T sub g. If is found that in the temperature ranges examined, the relaxation times obtained from SHG are several orders of magnitude longer than those measured by dielectric relaxation. This is explained as being due to the strong correlation between oriented dipoles and to trapped charges injected by the poling process. Fitting measured data to the Williams-Landau-Ferry (WLF) equation indicates that more free volume is needed in SHG for dipolar reorientation than is needed in DR. An SHG relaxation elongation phenomenon at constant temperature is found to occur in the pure bulk polymers and is similar to that found in chromophore- doped polymers previously studied. The SHG technique is developed as a new tool to directly study the reorientational dynamics of polar polymer segments.

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Document Details

Document Type
Technical Report
Publication Date
Jun 15, 1994
Accession Number
ADA283023

Entities

People

  • C. H. Wang
  • H. W. Guan
  • M. A. Pauley
  • T. Brett

Organizations

  • University of Nebraska-Lincoln Department of Chemistry

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Charge Transfer
  • Chemistry
  • Dielectric Permittivity
  • Dipole Moments
  • Electric Fields
  • Electromagnetic Fields
  • Elongation
  • Equations
  • Films
  • Glass Transition Temperature
  • Ground State
  • High Temperature
  • Materials
  • Orientation (Direction)
  • Relaxation Time
  • Second Harmonic Generation
  • Steady State

Fields of Study

  • Physics

Readers

  • Materials Science and Engineering.