Reliability Without Hermeticity (RWOH) for Integrated Circuits (IC)

Abstract

This effort establishes baseline performance data for an inorganic (ceramic) protective coating over integrated circuits in plastic packages. Severe and differentiating environmental stress testing demonstrated protection against humidity beginning to approach the protection offered by hermetic packaging. Advantages in size and weight are inherent in the technology.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1994
Accession Number
ADA284340

Entities

Organizations

  • National Semiconductor

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Ceramic Materials
  • Chemical Synthesis
  • Chemistry
  • Dielectrics
  • Environmental Tests
  • Fabrication
  • Failure Mode And Effect Analysis
  • Integrated Circuits
  • Materials
  • Materials Science
  • Materials Testing
  • Semiconductors
  • Silicon Carbide
  • Spectra
  • Spectroscopy
  • Test And Evaluation
  • Test Methods

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Surface Coatings Technology.
  • Systems Analysis and Design