The Reliability of Laser Reflowed Sn-Ag Solder Joints

Abstract

This is the second quarterly report of a project aimed at determining the reliability of electronic interconnects made with Sn-3.5wt% Ag solder alloy. Isothermal creep testing is now complete. The testing procedure is outlined in Report 1. Only results will be given here. Each creep curve was decomposed assuming linear addition of three strain components: elastic, transient, and steady state strain. Young's modulus values of pure Sn as a function of temperature were taken from Drapkin and Kononenko. These data were fit linearly resulting in the equation given below which was used to calculate the elastic strain for a given test.

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Document Details

Document Type
Technical Report
Publication Date
Aug 31, 1994
Accession Number
ADA284732

Entities

People

  • C. H. Raeder
  • D. L. Millard
  • R. W. Messler

Organizations

  • Rensselaer Polytechnic Institute

Tags

DTIC Thesaurus Topics

  • Constitutive Equations
  • Creep
  • Crystal Structure
  • Data Reduction
  • Equations
  • Grain Size
  • Heat Of Activation
  • High Temperature
  • Modulus Of Elasticity
  • Reliability
  • Steady State
  • Strain Rate
  • Stresses
  • Three Dimensional

Fields of Study

  • Engineering

Readers

  • Electrical Engineering
  • Integrated Circuit Design and Technology.
  • Mechanical Engineering/Mechanics of Materials.

Technology Areas

  • Directed Energy
  • Microelectronics