Ceramic/Metal Composite CIrcuit-Board-Level Technology for Application Specific Electronic Modules (ASEMs)

Abstract

Most of the major elements of the LTCC-M technology have been developed, and all have been shown to be compatible. The development of the green tape ceramic has been completed. The materials and processing have been developed to fire this green tape to a Cu/Mo/Cu metal core such that a very dense ceramic is formed with zero lateral (x-y plane) shrinkage. Thick film conductors have been developed for use with this tape. The process for mass fabrication of electrical feedthroughs in the Cu/Mo/Cu core has been successfully extended to laser drilled holes as small as 7 mils in diameter. Additionally, thin film overlays with a photosensitive BCB (from Dow Chemical) dielectric have been deposited on top of the fired ceramic

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Document Details

Document Type
Technical Report
Publication Date
Sep 21, 1994
Accession Number
ADA285066

Entities

People

  • Barry J. Thaler

Organizations

  • Sarnoff Corporation

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Abstracts
  • Circuit Boards
  • Composite Materials
  • Dielectric Properties
  • Drilling
  • Fabrication
  • Films
  • High Density
  • Insertion Loss
  • Laser Drilling
  • Materials
  • Materials Processing
  • Metal Matrix Composites
  • Self Assembly
  • Softening Point
  • Thick Films
  • Thin Films

Fields of Study

  • Materials science

Readers

  • Nanofabrication and Microfabrication.
  • Reinforced Composite Materials
  • Software Engineering

Technology Areas

  • Directed Energy
  • Directed Energy - Pulsed-Laser Deposition
  • Microelectronics
  • Microelectronics - Graphene