Morphology of Extinguished Monolithic JA2 Grains Fired in a 30-MM Solid Propellant Electrothermal-Chemical (SPETC) Gun.

Abstract

Monolithic grains of JA2 were fired in a 30-mm solid propellant electrothermal-chemical (SPETC) gun and were recovered after self-extinguishing because of depressurization. A morphological investigation was performed on these grains to gain insight into the interaction between the plasma and the propellant. Scanning electron microscopy (SEM) was used to characterize the morphology of the combustion surface and bulk of the propellant. Results show that the propellant burning surface was pitted and showed evidence of both brittle fracture and plastic flow. These features were the results of rapid pressurization within the single perforated grain caused by the plasma injection and the subsequent burning. Regions within the propellant showed evidence of augmented mass generation when compared with conventional propellant combustion. Mechanisms causing this accelerated burning are conjectured; they included erosive burning, fracture-generated tunneling, and in-depth buming. Micrographs are presented to support these findings and proposals are made to exploit these enhanced burning processes. SPETC, ETC, JA2, Gun propellants, Morphology, Extinguished.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1994
Accession Number
ADA285792

Entities

People

  • Christopher J. Gillich
  • Robert J. Lieb

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Weapons Technologies

DTIC Thesaurus Topics

  • Artillery
  • Burning Rate
  • Combustion
  • Electric Power
  • Energetic Materials
  • Erosive Burning
  • Gun Propellants
  • High Pressure
  • Jet Propulsion
  • Materials
  • Materials Laboratories
  • Materials Science
  • Mechanical Engineering
  • Military Research
  • Munitions
  • Propellants
  • Solid Propellants

Fields of Study

  • Physics

Readers

  • Rocket Propulsion.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics