Geometric Characterization of Electromigration Voids (A Statistical Analysis of Electromigration Voids)

Abstract

The areas, perimeters, lengths, and widths of 998 electromigration induced voids on 38 test stripes have been measured by SEM and digital image analysis. Virtually all of the voids occurred along the passivation-conductor interface on the side of the stripe. A plot of the number of voids on each stripe versus time to failure does not extrapolate to zero at zero time to failure, which suggests there are a certain number of active sites predisposed to voiding. Electromigration, Voids.

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1994
Accession Number
ADA286494

Entities

People

  • Peter Grach
  • Yolanda J. Kime

Organizations

  • State University of New York

Tags

Communities of Interest

  • Advanced Electronics
  • C4I

DTIC Thesaurus Topics

  • Abstracts
  • Air Force
  • Command And Control
  • Computational Science
  • Computer Science
  • Data Science
  • Digital Images
  • Electron Microscopes
  • Grain Boundaries
  • Images
  • Information Science
  • Materials
  • Scanning Electron Microscopes
  • Square Roots
  • Statistical Analysis
  • Subatomic Particles
  • Temperature Gradients

Fields of Study

  • Engineering

Readers

  • Fluid Mechanics and Fluid Dynamics.
  • Systems Analysis and Design
  • Thin Film Deposition Science.