Micro-Time Stress Measurement Device Development.
Abstract
This report describes the Micro-Time Stress Measurement Device (TSMD) developed and delivered under this contract. The Micro-TSMD is a microprocessor controlled device to read the installed environmental sensors and record their results in a non-volatile memory. It is contained in a hybrid package about 1 x 1.8 x 0.2 (inches), weighing less than an ounce. The TSMD contains sensors for temperature, mechanical vibration/shock, and DC voltage monitoring, including transients, and may be connected to external sensors. It requires external power. This project was funded by the RAMTIP Program Office at WPAFB OH.
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 01, 1994
- Accession Number
- ADA289511
Entities
People
- Gary Harvey
- Steven Buska
- Steven Louis
Organizations
- Honeywell International, Inc.