The Measurement Of Adhesion At Film-Substrate Interfaces Using A Constant Depth Scratch Test.

Abstract

By using a constant depth scratch test, the interfaces shear strength of various thin film/substrate interfaces can be determined. The ability to quantitatively ascertain when thin film debonding occurs has become especially important in the fields of electronics, optics, and protective coatings. A new model and experimental apparatus have been developed in order to more accurately determine thin film interfacial shear strength. While other tests are either qualitative in nature or experimentally difficult, the constant depth scratch test, which utilizes a Vickers microindenter for scratching a film/substrate system to debond the interface, produces quantitative results that are based upon a simple model. Since the depth is maintained constant during scratching, the complexity of the analytical formulation is reduced considerably, enabling the calculation of a numerical value for shear stress. Tests were conducted on chromium films on glass, gold thin films on aluminum nitride, and diamond films on aluminum nitride in order to determine and compare various interfacial shear strengths. (AN)

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1994
Accession Number
ADA289940

Entities

People

  • John C. Campbell

Organizations

  • Naval Postgraduate School

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Weapons Technologies

DTIC Thesaurus Topics

  • Adhesion
  • Aluminum Nitrides
  • Coatings
  • Data Acquisition
  • Diamond Films
  • Films
  • Materials
  • Measurement
  • Mechanical Engineering
  • Mechanical Properties
  • Mechanics
  • Shear Strength
  • Shear Stresses
  • Stresses
  • Substrates
  • Test Methods
  • Thin Films

Fields of Study

  • Physics

Readers

  • Mechanical Engineering/Mechanics of Materials.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene